1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual.
2. Cast iron framework for rigidity. Punching dies are changeable. Easy set up of punching dies.
3. Moveable lower die for easy loading and unloadingPCB punch die| FPC die| PCB punch mold| FPC mould
Specifications:
Model: |
YSPE |
Size: |
730 X 810 X 1700 mm |
Power supply: |
110/220 v |
Depression: |
0.45-0.70 Pa |
Weight: |
530/700 Kg |
Operation picture:
1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual.
2. Cast iron framework for rigidity. Punching dies are changeable. Easy set up of punching dies.
3. Moveable lower die for easy loading and unloadingPCB punch die| FPC die| PCB punch mold| FPC mould
Specifications:
Model: |
YSPE |
Size: |
730 X 810 X 1700 mm |
Power supply: |
110/220 v |
Depression: |
0.45-0.70 Pa |
Weight: |
530/700 Kg |
Operation picture:
Address: Building H, GuoRui Pioneering Park,
No. 1068 Jinyang East Road, Lujia Town, Kunshan,
Suzhou.